sniper_spike wrote:Skyone, I'm beginning to question your nerdiness. Thermal epoxy is used for greater thermal conductivity between ICs and heatsinks; the greater the conductivity, the more heat is dissapated into the heatsink. The less heat on the IC, the better it can perform, and the better it can be OCed.
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I'm not a nerd, at all.
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Thermal epoxy is used for greater thermal conductivity between ICs and heatsinks; the greater the conductivity, the more heat is dissapated into the heatsink. The less heat on the IC, the better it can perform, and the better it can be OCed.
